Indian Journal of Engineering and Materials Sciences (IJEMS)
20-Apr-2024 13:07:36 IST
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http://op.niscair.res.in/index.php/IJCT/article/view/2944/465464960
http://op.niscair.res.in/index.php/IJCT/article/view/4869/465464963
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Nagarajaiah, Kusuma, Central Manufacturing Technology Institute, Bengaluru, Karnataka 560 022, India
Vol 28, No 2 (2021): IJEMS- April-2021
- Review Articles
Cu-Cu thermo compression wafer bonding techniques for micro-system integration
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Indian Journal of Engineering and Materials Sciences (IJEMS)