Characterization of finished surface through thermal additive centrifugalabrasive flow machining for better surface integrity
Abrasive Flow Machining (AFM) process has been a useful technique for deburring and polishing of the surface andedges through the abrasive laden media. The surface material has been removed in form of micro chips due to abrasionaction of sharp cutting edges abrasive particles. A large amount of force and energy has been lost due to frictional forcesbetween the surface and abrasive particles in AFM process. A new hybrid form of AFM process named as thermal additivecentrifugal abrasive flow machining (TACAFM) has been discussed in the present investigation, which utilized the sparkenergy to melt the surface material. A lesser amount of force has been required by the abrasive particles to remove themolten material from the surface and also minimized the energy loss. In the present investigation central composite designresponse surface methodology has been used to plan and conduct the experiments using Design Expert® 11 software.Experiments have been performed to analyze the effect of input process variables such as current intensity, duty cycle,abrasive concentration, rotational speed of the electrode and extrusion pressure on scatter of surface roughness, microhardness and % improvement in Ra of the workpiece. Also the finished surface of the brass work piece has beencharacterized for the microstructure study using SEM and XRD analysis. From the experimental results it has been foundthat duty cycle has the most significant effect towards Scatter of surface roughness with a contribution of 17.5 % whilecurrent has been contributed largest as 85.17 % towards micro hardness. Also it has been observed that current hascontributed largest as 21.88% against the % improvement in Ra. The optimum scatter of surface roughness, micro hardnessand % improvement in Ra has been observed as 0.15 μm, 345.95 HV and 39.52 % respectively.
Abrasive Flow Machining (AFM), Abrasives, Finishing, Hardness, Scanning Electron Microscopy (SEM),X-Ray Diffraction (XRD), Machining, Spark
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