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T

T P, Gowrishankar, gowrishankartp01@gmail.comDepartment of Mechanical Engineering, R L Jalappa Institute of Technology, Bangalore, Karnataka, India Nagamangala Taluk, Mandya District, Karnataka State, India
Tadge, Prashant, Department of Materials Science & Metallurgical Engineering, Maulana Azad National Institute of Technology, Bhopal 462003, India
Takahashi, Tatsuhiro, Department of Organic Device Engineering, Yamagata University, 4-3-16 Jonan, Yonezawa, Yamagata 992 5810, Japan
Tarannum, Hina, Department of Chemistry, Taibah University, Yanbu, KSA
Tevatia, Abhishek, Department of Mechanical Engineering, Netaji Subhas University of Technology, Dwarka, New Delhi – 110078, India
Thakur, Ankit, Dr. B. R. Ambedker National Institute of Technology, Jalandhar 144011, Punjab, India
Thipperudrappa, Nagaraja, Department of Mechanical Engineering, Sri Jagadguru Mallikarjuna Murugharajenedra Institute of Technology, Chitradurga 577 502, Karnataka, India
Thippeshappa, Sridhara, Department of Mechanical Engineering, Sri Dharmasthla Manjunatheswara Institute of Technology, Ujire 574 240, Karnataka, India
Titus, Vinny Ann, Department of Civil Engineering, AmalJyothi College of Engineering, Koovapally P.O, Kanjirapally686518, India
Tiwari, Arun Kumar, Department of Mechanical Engineering, Institute of Engineering and Technology, Lucknow 226021, India
Topalski, Slavcho, Fraunhofer Institute for Material and Beam Technology, IWS, Dortmunder Oberflächen Centrum DOC, 44145 Dortmund, Germany
Torres, Martin Zapata, Instituto Politécnico Nacional, Research Center for Applied Sciences and Advanced Technology (CICATA-IPN), Mexico City 11500, Mexico
Toutam, Vijay Kumar, Advanced Carbon Products and Metrology Section, Advanced Materials and Devices Metrology Division, CSIR-National Physical Laboratory, New Delhi 110 060, India
Trapaga-Martinez, Gerardo, Research Department, CINVESTAV-Queretaro, Libramiento Norponiente No 2000. Fracc. Real de Juriquilla, 76230, Queretaro, Qro., Mexico

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Indian Journal of Engineering and Materials Sciences (IJEMS)